reflow soldering guidelines for rohs* compliant e-series surface mount components rev. b AN-010 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 1 visit www.macomtech.com for additional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or inform ation contained herein without notice. introduction this application note describes recommended prac- tices and guidelines for the successful assembly of m/a-com technology solutions e- series surface mount components using automated solder reflow techniques. incorrect handling, stor- age, reflow and cleaning may damage the compo- nents. handling and storage precautions most e-series components are static sensitive and are packaged accordingly. appropriate handling pre- cautions should be observed. the typical shelf life of these components is 24 months. however, corro- sive, salty or high humidity atmospheres can have an adverse affect on the solderability of contact pads/pins. manual handling of the components is not recommended. solder pad layout each e-series surface mount data sheet recommends a solder pad layout based on ipc standards. deviation from these recommended layouts can adversely effect the solder joint strength and integrity. component construction all m/a-com technology so lutions e-series compo- nents are designed to withstand solder reflow condi- tions, as recommended in this application note. the table below details the construction of our most popu- lar surface mount components. component construction substrate type plating construction cover material (where applicable) ceramic leadless electroless nickel immersion gold (enig) high temperature polymer mould high temperature 6/6 nylon disk dap sot sn over copper fr-4 leadless enig high temperature polymer mould high temperature 6/6 nylon disk galvanised steel solder paste m/a-com technology solutions e-series compo- nents are designed to work with most recom- mended reflow profiles for the sac305/sac405 type solders, and are fully compatible with the stan- dard reflow profiles used for the sn60, sn62 and sn63 solder pastes, including no-clean pastes. for most case styles, a paste thickness of 0.25mm 0.05mm will provide an adequate solder joint. for the sm-22 case style, a solder paste thickness of 0.20mm 0.025mm is recommended. component placement e-series components are designed for placement using automatic pick and place equipment. component placement is critical to negate shorts caused by solder bridging. most e-series components can accept a side overhang of up to 50% of the pad width, and a toe overhang of up to 10% of pad length. for the sm-22 case style, side overhang must be less than 25%, and toe overhang less than 5%. * restrictions on hazardous substanc es, european union directive 2002/95/ec.
reflow soldering guidelines for rohs* compliant e-series surface mount components rev. b AN-010 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 2 visit www.macomtech.com for additional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or inform ation contained herein without notice. general soldering precautions: lead-free soldering process relation of qualification profile and actual production profile the profiles listed in this document are not production reflow profiles, but are related to those profiles with an added margin of safety to account for oven variation, temperature drift, and product variation and process robustness. the actual profile used in production will be dictated primarily by the solder composition selected. process requirements the ovens used should be 100% convection reflow. where applicable, thermocouples should be securely attached to the top surface of a representative com- ponent to insure the temperature exposure. this can be done three times. condition average ramp-up rate (30c to 217c) > 100c > 150c > 217c peak temperature cool-down rate (peak to 50c) time from 30c to 255c all temperatures shown are +5/-0c exposure less than 3c / second between 360-600 seconds at least 240 seconds at least 90 seconds greater or equal to 255c at least 15 seconds less than 6c / second no greater than 360 seconds temperature (c) time above 100c < 360sec time from 25c to peak = 360sec peak temperature > or = 255c time above 150c > 240sec time above 217c > 90sec time (sec) pb-free reflow profile envelope extreme profile envelope minimum reflow envelope we recommended 90 seconds above 217c with a maximum temperature of 260c. the 60 seconds at temperatures >250c is the maxi- mum duration these package types should be ex- posed to.
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